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Taiwan Semiconductor Manufacturing ADR
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152
1Sem.·
- Intel $INTC (+1,8 %) says it will use TSMC short-term if it delivers better products, calling $TSM (+0,43 %) the "benchmark for what's expected in the industry.
- INTEL $INTC CFO SAYS WILL SELL MORE OF MOBILEYE $MBLY STAKE OVER TIME; AND PLANS TO ULTIMATELTY TAKE ALTERA PUBLIC
- Intel $INTC Exec Says Company Will Invest More in Products Under New Leadership; Stresses Need for Better ROI on Prior Investments – Barclays Conference.
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1 Commentaire
Luca H.@LMHNK
1Sem.
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1Sem.·
I consider my tech stocks like $FTNT (+1,49 %) and $TSM (+0,43 %) due to the upcoming correction
what do you think makes sense?
lg
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27 Commentaires
$TSM will continue as long as the Chinese do not invade. In my opinion, there is still a lot of potential and the company is very well positioned.
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1Sem.·
Overview of Semiconductor Manufacturing and Chipmaking Tools Markets
Smartphones, smart cars, LED lighting displays, gaming devices, and countless other Internet of Things (IoT) devices all share a common foundation: semiconductors. These technologies wouldn't exist without semiconductors. The invention of the integrated circuit in 1958 sparked the Third Industrial Revolution, propelling the world into the digital age. Today, everything digital relies on semiconductors, making them the backbone of our increasingly connected world.
Digitalization is pervasive and is expected to continue expanding. As a result, the amount of data that needs to be stored, processed, and transmitted is growing exponentially. The rise of artificial intelligence (AI) and its integration into everyday workflows has further fueled the demand for computing power. To keep pace with this demand, semiconductor production must increase in both volume and capability. Additionally, the significance of the semiconductor equipment market cannot be overstated, as it plays a crucial role in enabling these advancements in semiconductor technology.
Moore’s Law, which predicts that computing efficiency should double every two years, highlights the need for continuous innovation in semiconductor technology to meet the demands of new and emerging technologies. According to Pat Gelsinger, CEO of Intel Corp., semiconductor manufacturing and design will play a role in global geopolitics over the next few decades, akin to the significance of oil production in the last 50 years.
The world faces a significant challenge: ensuring an adequate supply of advanced semiconductors. But who is responsible for this? Who are the key players in the semiconductor market? This article aims to unravel the complexity of semiconductor production and introduce you to the major companies and countries driving this critical industry. While my expertise in engineering is limited, I am confident that by the end of this article, you will understand why companies involved in semiconductor production are so attractive to investors.
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Market Structure of the Semiconductor Industry
The semiconductor market is highly complex and structured around several key segments that encompass the entire supply chain. The market is structured as follows:
Design and IP (Intellectual Property)
- Fabless Companies: These companies focus on the design and development of semiconductor chips but do not manufacture them. They outsource manufacturing to foundries. Examples include Qualcomm $QCOM (+2,48 %) , Qualcomm $NVDA (+2,01 %) , and Advanced Micro Devices $AMD (-0,35 %).
- IP Providers: These companies develop and license intellectual property (IP) cores that are used in semiconductor designs. ARM Holdings, for example, licenses its processor designs to various chipmakers.
Semiconductor Manufacturing
- Foundries: These companies specialize in manufacturing semiconductor wafers and chips designed by fabless companies. They operate large-scale fabrication plants, often called fabs. Key players include Taiwan Semiconductor Manufacturing Company $TSM (+0,43 %) , GlobalFoundries, and Samsung Foundry.
- Integrated Device Manufacturers (IDMs): These companies handle both design and manufacturing of semiconductors. They own and operate their own fabs. Intel, Samsung Electronics, and Micron Technology are prominent IDMs.
Equipment and Materials Suppliers
- Semiconductor Equipment Manufacturers: These companies supply the machinery and tools required for semiconductor manufacturing, including lithography machines, etching equipment, and testing machines. Key players include $ASML (-1,59 %) ASML, $AMAT (+0,53 %) Applied Materials, and$LRCX (+0,38 %) Lam Research.
- Materials Suppliers: These companies provide the raw materials necessary for semiconductor production, such as silicon wafers, chemicals, and gases. Companies like Shin-Etsu Chemical and SUMCO are major suppliers in this segment.
The combined revenues from all segments, along with contributions from smaller beneficiaries, make up the total semiconductor market. In 2023, the market was valued at $544 billion and is projected to grow to approximately $1.14 trillion by 2033, reflecting a compound annual growth rate (CAGR) of 7.64% over the forecast period from 2024 to 2033.
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TSMC is the largest semiconductor manufacturer with over 70% of share of the market
In the semiconductor manufacturing market, Taiwan Semiconductor Manufacturing Company (TSMC) holds the largest share, accounting for around 60%. Samsung and GlobalFoundries have market shares of approximately 10% and 5%, respectively. These figures highlight that over 70% of the world's semiconductors are produced in Asia, with 60% coming from Taiwan alone.
In 2020, the COVID-19 pandemic disrupted global supply chains, and with semiconductor production heavily concentrated in Asia, even minor disruptions led to a significant chip shortage. This situation served as a wake-up call, exposing the world's heavy reliance on these critical components and the fragility of the supply chain. Consequently, the semiconductor market is highly sensitive to geopolitical tensions and economic conflicts, such as export/import tariffs and sanctions. These measures can restrict direct sales or limit manufacturers' access to essential raw materials and chipmaking tools, further exacerbating supply chain vulnerabilities.
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Key Players in Semiconductor Manufacturing
Taiwan Semiconductor Manufacturing Company NASDAQ: $TSM (+0,43 %)
TSMC is poised to cement its leadership of the industry by acquiring more advanced photolithography equipment in the coming decade. Data from SEMI highlights its ambitious trajectory, indicating a potential doubling of its advanced-nodes capacity in the coming eight years, the fastest among the leading trio of firms. TSMC has upgraded its technology node approximately every 24-36 months since 2014. TSMC's capital expenditure (CapEx) intensity is about 35% of its revenue. With an expected revenue growth rate of 8.5% annually over the next decade and maintaining a CapEx intensity of 35%, TSMC could potentially allocate around $400 billion to equipment investments during this period.
TSMC’s comprehensive suite of advanced packaging services, ranging from 2D to 3D solutions, is set to attract strong demand from leading chip designers such as Nvidia, Qualcomm, and Tesla. These services are expected to cater to key sectors including AI, cloud computing, and smartphones.
TSMC's sourcing strategy underscores its strong ties to leading global semiconductor suppliers, particularly those from Japan. In 2018-2022, of the 31 suppliers recognized by TSMC's outstanding-performance award, 14 were Japanese, reflecting a clear affinity. The US followed with seven suppliers and Europe with six. Among TSMC's top five suppliers by revenue, ASML, Applied Materials, Tokyo Electron and Lam Research have consistently won the excellence award for the past five years, underscoring their industry-leading positions and commitment to TSMC. As TSMC expands its manufacturing horizon, these key relationships suggest sustained and potentially increased order flows for the top-tier suppliers.
INTEL NASDAQ: $INTC (+1,8 %)
Intel's ambitious foundry plans under its IDM 2.0 strategy, which involves opening its manufacturing capacity to external customers, are expected to drive a significant increase in capital expenditures over the next few years. The company is poised to benefit from US government-led subsidies, particularly through the CHIPS Act, signed into law on August 9, 2022. This legislation provides $52 billion in incentives for semiconductor manufacturing and research in the US, offering crucial support amid escalating trade tensions with China.
In 2022, Intel’s gross capex was $25 billion, representing about 40% of its revenue. This figure is projected to rise to approximately 45% by 2032. Intel is expected to lead its semiconductor-manufacturing counterparts in gross capital intensity over the next few years, although it will remain behind leading peers in terms of absolute capex dollars spent. This investment is set to introduce a range of new technologies, starting with the integration of EUV tools in Intel 4, followed by advanced Foveros packaging, and ultimately the highly anticipated high-NA EUV technology with Intel 18A—a node designed to secure industry leadership for the company.
Beyond cutting-edge node manufacturing, Intel's expertise in packaging—including chiplets, glass substrates, and Foveros packaging—will be a key differentiator for its customers and a competitive advantage for suppliers. Intel is transitioning from its traditional role as an integrated-device manufacturer to become a leading manufacturing supplier for the fabless chip industry. This shift involves a more collaborative approach, with Intel acting as a customer, supplier, and even competitor to the same companies.
As Intel embarks on its first EUV lithography manufacturing node (Intel 4), suppliers of EUV-associated solutions are expected to become key partners, with ASML, the world’s leading EUV toolmaker, being particularly crucial. Although past contract awards do not guarantee future success, suppliers with a history of consistent and repeated contract wins are likely to continue benefiting from growing business with Intel. To date, Intel’s top suppliers have remained relatively stable, with Applied Materials, Tokyo Electron, Lam Research, and Senju Metal consistently securing major contracts.
Samsung
Samsung Electronics is expected to account for 20% of global chip investment through 2032, focusing on logic, DRAM, and NAND chips. The company aims to produce 1.4-nm chips by 2027 and is advancing with 5-nm, 4-nm, and 3-nm technologies. It leads in DRAM with EUV technology and may adopt high-NA EUV tools for 1-nm chips by 2030.
Samsung plans to expand production in the US with a $17 billion investment in its Taylor, Texas plant, aiming for 40,000 wafers per month by 2024, and potentially adding another facility by 2027. It might add up to nine fabrication facilities over the next 20 years.
Samsung's capital expenditure for chip manufacturing could rise to $50-$55 billion annually by 2032, up from $37 billion in 2022. The breakdown is projected to be 22% for DRAM, 34% for NAND, and 44% for foundry/IDM.
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How Much Do Manufacturers Invest?
The semiconductor manufacturing business is highly capital-intensive. The growing demand for data collection, computation, and transfer drives the need for more powerful and energy-efficient chips. To meet this demand, manufacturers must continuously innovate their production processes, requiring substantial investments in fabrication facilities (fabs).
According to Bloomberg Intelligence, semiconductor makers’ capital expenditures could expand from $136 billion to $262 billion in 2032, about 1.9x its level in 2023, mainly because of robust shipments of logic chips. TSMC and Samsung will account for 43% of the industry’s entire capex in 2032.
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Importance of Miniaturization in Chipmaking
Miniaturization in circuit devices focuses on fitting more transistors onto smaller integrated circuits, which leads to more cost-effective chip production and reduced power consumption. Since semiconductor power consumption is proportional to the square of the drive voltage, lowering the drive voltage results in a substantial decrease in power consumption, achievable through finer wiring patterns.
If transistors were 20 nm in size in 2014, they have already shrunk to 3 nm by 2024. The reduction in transistor size highlights the rapid pace of advancement in semiconductor technology.
Although the benefits of further miniaturization may diminish in terms of performance gains and cost efficiency, its impact on energy efficiency remains significant. Miniaturization will continue to be a crucial focus for semiconductor technology over the next 10-15 years, driving improvements in performance, cost, and energy efficiency.
Moore's Law, which predicts that the number of transistors on a chip will double approximately every two years, underscores the importance of miniaturization in meeting the increasing demand for computational power. This trend not only facilitates enhanced performance but also boosts power efficiency, making miniaturization a fundamental strategy for future advancements.
Additionally, miniaturization spurs innovation in fabrication tools. As transistors shrink, the precision and capabilities of manufacturing equipment must evolve accordingly. This continual upgrade of tools ensures that production processes remain state-of-the-art, supporting ongoing progress and innovation in the semiconductor industry. This is why Foundry business is very capital-intensive.
Growing capital expenditure in the absolute form implies the demand for chipmaking tools that manufacturers buy to maintain and renovate their fabs. So, the companies that supply the machinery and tools required for semiconductor manufacturing, including lithography machines, etching equipment, and testing machines will benefit from it. In order to understand the importance of each tool used in the semiconductors' production process, we need to explore the process of production itself.
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Due to the constraints on the number of images in this post, I will pause here. However, in the next part of this article, I plan to dive deeper into the critical question: What do the leading semiconductor manufacturers need to meet the growing demand?
The answer lies in one key element—the equipment they must upgrade and innovate. In the upcoming article, I will explore the production process in greater detail, highlighting the advanced tools and machinery required to meet this demand. And trust me, without pictures, it will be hard to speak about.
Additionally, I will examine the key suppliers in this space and identify which companies stand to benefit most from the ongoing semiconductor boom. Stay tuned as we explore the technologies and players shaping the future of this high-growth industry.
Let me know in the comments or through reactions if you're interested in the continuation of this article! Your feedback will guide the next steps, so I’d love to hear your thoughts.
Source:
Bloomberg Intelligence
Precedence research
Statista
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1Sem.·
From sand to chip: how is a modern semiconductor made?
Reading time: approx. 10min
1) INTRODUCTION
Since 2023 at the latest and the rapid rise of Nvidia $NVDA (+2,01 %) semiconductors and "AI chips" in particular have been the talk of the town. Since then, investors have been chasing after almost every company that has something to do with the manufacture of chips, driving share prices to unimagined heights. However, hardly any investors really know how complex the value chain is within the production of modern chips.
In this article, I will give you an overview of the entire manufacturing process and the companies involved. Even if many of you have a vague idea that the production of modern chips is complex, you will certainly be surprised by how complex it really is in reality.
2) BASIC
The starting point for every chip are so-called wafers [1] - i.e. thin wafers, which usually consist of so-called high-purity monocrystalline silicon. In the field of power semiconductors, which primarily comprises chips for applications with higher currents and voltages, silicon carbide (SiC) or galium nitride (GaN) has recently also been used as the base material for the wafers.
In the so-called front end the actual core components of the chips - the so-called dies - are created and applied to the wafers. The dies are rectangular structures that contain the actual functionality of the later chip. The finished dies are then tested for their functionality and electrical properties. Each die that is found to be good is then integrated into the so-called backend where the individual dies are separated on the wafer. This is followed by the so-called packaging. The individual dies from the front end are then electrically contacted and integrated into a protective housing. In the end, this housing with the contacted die is what is usually called a chip chip.
Now that we have a rough overview of the overall process, let's take a closer look at the individual processes involved in producing the dies on the wafer. This is the area in which most highly complex machines are used and which is usually the most sensitive.
3) FROM SAND TO WAFER
Before wafers made of high-purity silicon can even be produced and the actual process for manufacturing dies can begin, the actual wafer must first be manufactured in almost perfect quality. To do this, quartz sand, which consists largely of silicon dioxide, is reduced with carbon at high temperatures. This produces so-called raw siliconwhich, with a purity of around 96%, is not yet anywhere near the quality required for the production of wafers.
In several chemical processes, which are carried out by Wacker Chemie
$WCH (+1,9 %) or Siltronic
$WAF (-3,21 %) are used to turn the "impure" silicon into so-called polycrystalline silicon with a purity of 99.9999999%. For every billion silicon atoms, there is then only one foreign atom in the silicon. However, this pure polycrystalline silicon is still not suitable for the production of wafers, as the crystal structure in the silicon is not uniform enough. In order to create the right crystal structure, the polycrystalline silicon is then melted again and a so-called ingotwhich is made from monocrystalline silicon is produced. A comparison between raw silicon and the ingot can be found in the following image [3]:
This ingot is then sawn into thin slices, which are then the final wafers for semiconductor production. The best-known wafer producers are Shin Etsu
$4063, (-1,14 %)
Siltronic or GlobalWafers
$6488.
4) FROM THE WAFER TO THE DIE
The wafers described in the previous section can now be used to produce dies. The overall process for producing dies basically consists of applying a large number of layers using various chemical, mechanical and physical processes. The overall process (depending on the product) takes approx. 80 different layers on the wafer, requiring almost 1000 different process steps and 3 months
non-stop production are required [4].
A macroscopic analogy is useful here, which I have also taken from [4]. You can compare the overall process for producing dies with baking a large multi-layer cake. This cake has 80 layers and the recipe for baking consists of 1000 steps. It takes 3 months to make the cake and if even one layer of the cake deviates from the recipe by more than 1%, the whole cake collapses and has to be thrown away.
In the first process steps, the wafer is covered with billions tiny little transistors are created on the wafer, which are then all individually electrically contacted in the following steps. The final steps consist of electrically connecting the transistors to each other, resulting in a complete electrical circuit [4]:
Each individual layer of the approximately 80 layers in the die requires highly specialized processes, which can be roughly summarized as:
- Applying masks: Photolithography, photoresist coating (applying photoresist)
- Apply material: Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), Atomic Layer Deposition
- Remove material: Plasma annealing, Wet annealing, Chemical Mechanical Planarization (CMP)
- Modify material: Ion Implanting, Annealing
- Material cleaning
- Inspecting the layers: Optical, Microscopical, Focused Ion Beam, Defect Inspection
Apply masks
Ultimately, a mask can be thought of as an enlarged copy of the structure of a special layer in the die. These so-called photomasks are then scanned using so-called scanners or steppers "copied" in reduced size onto the wafer. The best-known manufacturer of such lithography systems is ASML
$ASML (-1,59 %). It is currently the only producer of lithography systems that make it possible to produce structures smaller than 10 nanometers on the wafer. In today's powerful and modern chips, such as those found in smartphones, AI chips and processors, the smallest structures are around 3 nanometers in size. Other manufacturers of lithography systems for larger structures (10nm and larger) are Canon Electronics
$7739 or Nikon $7731 (+1,29 %) .
The photomasks - i.e. the enlarged "copies" of the structures - are produced by companies such as Toppan $7911 (-7,06 %) , Dai Nippon Printing
$7912 (-1,09 %) or Hoya $7741 (-3,54 %) manufactured. Systems for cleaning the photomasks or for applying the photoresist are produced, for example, by Suss Microtec
$SMHN (+0,76 %) for example.
Apply/remove/modify/clean material
As can be seen in the overview above, there are a variety of methods and processes for modifying the material of a particular layer. As a result, there is a lot of different equipment that can handle a process very well with incredible specialization. The best-known and most successful equipment manufacturers include Applied Materials $AMAT (+0,53 %), LAM Research
$LRCX (+0,38 %), Tokyo Electron (TEL)
$8035, (-0,76 %)
Suss Mictrotec, Entegris
$ENTG (-0,55 %) and Axcelis $ACLS (-0,8 %).
The material - for example, highly specialized chemicals - is of course also required for production. Companies such as Linde
$LIN (+0,54 %), Air Liquide
$AI (-0,22 %), Air Products
$APD (+0,04 %) and Nippon Sanso
$4091 (+0,26 %) are major manufacturers of process gases such as nitrogen, hydrogen and argon.
Inspect
As mentioned, every single layer in the manufacturing process of a die must be perfect in order to obtain a functional die at the end. Any small deviation or foreign particles can impair the functionality of the die. As the function of the die can only be checked precisely on the finished die, it is advantageous to inspect the individual layers for defects and deviations during production. Special machines are required for this, which must be able to do different things depending on the layer. Manufacturers of such machines include KLA
$KLAC (+0,46 %) or Onto Innovation
$ONTO (-0,62 %).
The following applies to almost all of the companies mentioned in this section: the companies are highly specialized and have quasi-monopolies on the machines for certain process steps. quasi-monopolies. Suitable equipment therefore usually costs several million dollars. In addition, some of the systems are so complex that they can only be serviced by the manufacturer's own service staff, which results in recurring service revenues for every machine sold. As a rule, each machine requires several highly specialized engineers to ensure long-term stable operation.
5) FROM THE DIE TO THE FINISHED CHIP
Once the wafer has been processed, the dies on the wafer are checked for functionality. There is highly specialized equipment for this, so-called probers. These probers test each individual chip several times, if necessary, to check the functionality implemented in the design. Manufacturers of such probers include Teradyne $TER (-0,02 %), Keysight Technologies
$KEYS (+1,5 %), Onto Innovation or Tokyo Electron. These probers have to control each individual die, some of which are only a few square millimetres in size, and contact the corresponding much smaller test structures with tiny needles. The testing process is sometimes outsourced to entire companies that offer die testing as a complete package. One example of such providers is Amkor Technology
$AMKR (-0,58 %).
The processed and tested wafer is now sawn to obtain individual dies. The dies that are found to be good are then integrated into a protective housing in the backend. The dies that have not passed the functionality test are either sorted out or (depending on the error pattern) processed as a variant with reduced functionality similar to those with full functionality. After a final functional test in the package, the chip is ready for use.
6) FOUNDRIES, FABLESS & SOFTWARE
Now that we have an overview of the complex process of manufacturing a chip, let's zoom out a little further to understand which companies perform which tasks in the semiconductor industry.
It's funny that not once in the manufacturing process has the name Nvidia $NVDA (+2,01 %) or Apple $AAPL (+1,34 %) has been mentioned? Yet they have the most advanced chips, don't they?
The pure production of the chips is done by other companies - so-called foundries. Companies like Nvidia and even AMD $AMD (-0,35 %) are in fact fablessThis means that they do not have their own production facilities but only supply the chip design and let the foundries manufacture the actual chip according to their design.
The design of a chip is like the blueprint for production - the foundries then take over the recipe creation and the actual production. There is special software for designing chips. Companies known for this software include Cadance Design
$CDNS (+0,16 %) and Synopsys $SNPS (-1,06 %). But also the industrial giant Siemens
$SIE (-0,29 %) now also supplies software for designing integrated circuits. Synopsys also offers other software for data analysis within foundry production.
Speaking of foundries; the best known foundry is probably TSMC
$TSM, (+0,43 %) which is the global market leader in foundries. TSMC designs itself no chips itself and specializes exclusively in the production of the most advanced generations of chips. Another major player that also masters the most advanced structure sizes is Samsung $005930. In contrast to TSMC manufactures Samsung also produces its own designs. Other large foundries are Global Foundries
$GFS, (+0,33 %) which was originally a spin-off from AMD and the Taiwanese company United Micro Electronics
$UMC. (-0,79 %)
The best-known fabless companies - i.e. companies without their own chip production - are Nvidia, Apple, AMD, ARM Holdings
$ARM, (-2,66 %)
Broadcom $AVGO (+0,31 %), MediaTek $2454 and Qualcomm $QCOM. (+2,48 %) In the meantime Alphabet $GOOGL, (+0,94 %)
Microsoft $MSFT, (-1,05 %)
Amazon $AMZN (+0,26 %) and Meta $META (-2,23 %) have designed their own chips for certain functionalities and then have them manufactured in foundries.
In addition to foundries and fabless companies, there are of course also hybrid models, i.e. companies that take on both production and design. The best-known examples of this are, of course, companies such as Intel
$INTC (+1,8 %) and Samsung. There is also a whole range of so-called Integrated Device Manufacturer (IDM)which for the most part only manufacture their own designed chips and do not accept customer orders for production. Well-known companies such as Texas Instruments
$TXN, (-0,01 %)
SK Hynix
$000660,
STMicroelectronics
$STMPA, (-0,02 %)
NXP Semiconductors
$NXPI, (+0,87 %)
Infineon $IFX (-1,35 %) and Renesas $6723 (+2,12 %) are among the IDMs.
FINAL WORD
The aim of this article was to provide an overview of the complexity of the semiconductor industry. I do not, of course no claim to be complete, as there are of course many other companies that are part of this value chain. As Getquin thrives on active exchange, I'll give you some food for thought to discuss in the comments below the article:
- feel free to link any other companies in the comments if you think I've forgotten any relevant ones
- what was the most surprising new information for you from the article?
- which companies from the article have you never heard of?
- before reading the article, did you know approximately how a modern chip is produced and what steps are necessary for this?
In general, I can recommend the 20-minute YouTube video at [4] to any interested reader. It provides an excellent animated overview of the manufacturing process of modern chips.
Stay tuned,
Yours Nico Uhlig (aka RealMichaelScott)
SOURCES:
[1] Wikipedia: https://de.wikipedia.org/wiki/Wafer
[2] https://www.halbleiter.org/waferherstellung/einkristall/
[3] https://solarmuseum.org/wp-content/uploads/2019/05/solarmuseum_org-07917.jpg
[4] Branch Education on YouTube: "How are Microchips Made?" https://youtu.be/dX9CGRZwD-w?si=xeV0TYgJ2iwNOKyO
1Sem.·
Nvidia
$NVDA (+2,01 %) and Taiwan Semiconductor
$TSM (+0,43 %) are in talks about the production of Nvidia's new Blackwell AI chip at TSMC's new fab in Arizona 🇺🇸. - Reuters
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1Sem.·
Taiwan's 🇹🇼 exports jumped 9.7% year-on-year in November, driven by strong semiconductor demand and a recovery in trade with China, above expectations of 8% growth. $TSM (+0,43 %)
Semiconductor exports surged 15.5%, fueled by the booming AI industry, while exports to China rebounded 9.5% and shipments to the U.S. rose 10.6%.
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2Sem.·
$TSM (+0,43 %) & $NVDA (+2,01 %) IN TALKS FOR BLACKWELL CHIP PRODUCTION AT TSMC ARIZONA PLANT – REUTERS
NVIDIA and TSMC are in discussions to produce NVIDIA's Blackwell AI chips at TSMC's Arizona plant, with preparations underway to begin early next year, according to Reuters. Currently manufactured in Taiwan, Blackwell chips, known for their generative AI capabilities and 30x speed improvements, may transition to the U.S. facility, which is set for volume production in 2025.
However, packaging for the chips will remain in Taiwan due to Arizona's lack of CoWoS capacity, critical for Blackwell chips. The move could expand TSMC’s customer base at the Arizona facility, which already includes Apple and AMD. Neither NVIDIA nor TSMC have commented on the talks.
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2Sem.·
$NVDA (+2,01 %) and $TSM (+0,43 %) are reportedly accelerating development of the next-gen Rubin platform, potentially releasing it 6 months early (late 2025 vs. 2026). Nvidia's Rubin is the successor to Blackwell and will utilize TSMC’s 3nm process and advanced packaging technology, featuring a chip size twice that of Blackwell.
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1 Commentaire
2Sem.
Double the chip size and conversion to 3nm - that points to an official increase in performance ...
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2Sem.·
Depot review November 2024 - The depot is growing despite larger withdrawals 🚀
Before I continue with the second part of my investment story, I would first like to share my portfolio review for November.
The second half of November was almost quiet compared to what happened at the beginning of November. Trump was elected, triggering a veritable run on the stock markets. Germany was finally freed from the traffic lights and there were also some exciting topics in the private sphere. I sold a few shares back in October to generate the equity I needed to start building a house. This continued a little further in November.
Overall, my savings rate will also (have to) be lower over the next few months. Less into the portfolio and more into the "buffer account" for building the house. Nevertheless, around €500 per month will continue to be invested and this will be pushed up again as quickly as possible.
After selling 6 shares and an ETF in October, I sold parts of my MSCI World ETF for around €13,000.
But now it's finally time to look at the hard figures:
Monthly view:
In total, November was +6,3%. This corresponds to price gains of ~20.000€.
The MSCI World (benchmark) was +7.3% and the S&P500 +5.1%
Winners & losers:
A look at the winners and losers is particularly exciting this month:
On the winning side with a total of almost €5,000 in price gains, my crypto investments in Bitcoin and Ethereum. This is followed by the long runner NVIDIA with price gains of just under €2,000. 4th and 5th place then goes to the cybersecurity sector with Palo Alto Networks and Crowdstrike.
On the loser side looks very quiet this month. Amgen is still the worst performer with losses of ~€600 due to a weight loss drug that failed to fully meet Wall Street's hopes. This is followed by Sartorius with share price losses of €200. Places 3-5 are then occupied by share price losses of less than €100. All in all, a month with almost no losers.
The performance-neutral movements in October amounted to just under € -6,000. Parts have already been removed here for private topics.
current year:
My performance in the current year is +29,9% and thus above my benchmark, the MSCI World with 26.9%.
In total, my portfolio currently stands at ~345.000€. This corresponds to an absolute growth of ~€93,000 in the current year 2023. ~72.000€ of this comes from price gains, ~3.300€ from dividends / interest and ~16.000€ from additional investments.
Dividend:
- Dividends in November were 21% above the previous year at ~€160
- Procter & Gamble is in the lead with a (gross) dividend of €50 every 3 months.
- In the current year, the dividends after 11 months are +25% over the first 11 months of 2023 at ~2.500€
Buying & selling:
- I bought in November for significantly reduced ~700€
- As always, my savings plans were executed:
- Blue ChipsProcter & Gamble $PG (-1,24 %) TSMC $TSM (+0,43 %) S&P Global $SPGI (+0,02 %) Alphabet $GOOGL (+0,94 %) Johnson & Johnson $JNJ (+0,03 %) Amgen $AMGN (+0,51 %) Herhey $HSY (+0,03 %) Alimentation Couche-Tard $ATD (+1,09 %) Caterpillar $CAT (+0,86 %)
GrowthBechtle $BC8 (+0,82 %)
ETFsMSCI World $XDWD (+0,24 %) Nikkei 225 $XDJP (-0,32 %) and the WisdomTree Global Quality Dividend Growth $GGRP (-0,09 %)
CryptoBitcoin $BTC (-0,16 %) and Ethereum $ETH (+1,35 %)
Sales as mentioned at the beginning, there was a larger part of my MSCI World holdings in November
Target 2024 & outlook 2025:
My goal for this year is to reach €300,000 in my portfolio. Due to the extremely positive market performance in the current year, my portfolio already stands at ~€345,000 at the end of November.
As is well known, one should not praise the day before the evening, but I am optimistic that my portfolio will not fall so far in December that I will not reach my target.
What will happen in 2025? The logical goal would of course be to reach €400,000. However, due to the upcoming house construction, part of the assets will be invested in the house construction. If I include the property in my statement of assets, the target of €400,000 would of course not change. However, as I am tracking my liquid assets here, I will probably refrain from doing so.
Therefore, my year-end target for 2025 will probably be closer to the final balance for 2024. So around €350,000 at the end of 2025.
How are things looking for you? Have you already thought about your plans for 2025?
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As always, very interesting to read and good luck with the house construction 😀
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