SEOUL, Jan. 3 (Yonhap) - SK hynix Inc. announced Friday that it will showcase its cutting-edge artificial intelligence-based memory technologies and present its vision as a comprehensive AI memory provider at the upcoming CES 2025.
The chipmaker, which is currently a leader in high-bandwidth memory (HBM), will set up a joint exhibition booth with SK Group subsidiaries including SK Telecom Co. under the theme of "Innovative AI, Sustainable Future" at this year's CES, which kicks off on Tuesday (US time) in Las Vegas, according to SK hynix.
Top executives from SK hynix, including CEO Kwak Noh-jung and Kim Joo-seon, president of AI Infrastructure, will be present to highlight the company's technological advancements and strategic direction.
SK hynix aims to strengthen its position as a "full-stack AI storage provider" with the annual event, offering a wide range of AI-oriented storage products and technologies.
At CES 2025, SK hynix plans to showcase its innovations in on-device AI solutions, next-generation AI memory and its flagship HBM chips.
A highlight of the exhibition will be samples of the 16-layer HBM3E chips, the most advanced HBM technology to date, which will be officially launched in November 2024.
SK hynix is currently supplying customers with the 12-layer HBM3E chips while working on the development of HBM4, the sixth-generation HBM, in the second half of this year.
The company is also showcasing high-capacity, high-performance enterprise solid-state drive (eSSD) products, including the 122TB D5-P5336 model developed by its US subsidiary Solidigm in November last year.
"We will continue to do our best to demonstrate new possibilities in the AI era through technological innovation and provide irreplaceable value to our customers," CEO Kwak said in a press release.
https://www.koreatimes.co.kr/www/tech/2025/01/129_389660.html
