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SK hynix, the world's leading manufacturer of memory chips, is reviewing plans to build a new back-end production facility to strengthen its packaging capabilities in the face of rising demand for advanced chips.
According to industry sources, the memory chip maker announced on Tuesday via its internal bulletin board that it will build the new factory, named "P&T 7", on a site in Cheongju, North Chungcheong Province. The company has begun demolishing a former LG factory that it had previously acquired on the site for the new building. The work should be completed by September.
"The role of back-end processes in memory semiconductors is becoming increasingly important as they add significant value beyond traditional manufacturing," said an SK-Hynix official. "The company is committed to improving its packaging technology."
In Korea, SK hynix currently has six P&T buildings in Icheon and Cheongju, which are its back-end production facilities.
The construction schedule for the seventh building has not yet been finalized. However, it is planned that the site will serve not only as a packaging facility for end products, but also as a test factory.
The back-end process in chip manufacturing refers to the final stages of chip production where individual chips are cut from the wafer, tested and packaged into finished products.
As performance increases through semiconductor scaling reach their physical limits, advanced packaging technologies are gaining importance as a new way to improve performance and energy efficiency.
https://www.koreaherald.com/article/10516616
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