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TSMC Q4'24 Earnings Highlights

$TSM (+1,43%)


๐Ÿ”น Revenue: $26.24B (Est. 25.83B) ๐ŸŸข; +39% YoY

๐Ÿ”น Net Income: $11.31B (Est. $11.17B) ๐ŸŸข; +57% YoY

๐Ÿ”น Gross Margin: 59.0% (Est. 58.5%) ๐ŸŸข; +53% YoY

๐Ÿ”น Oper. Margin: 49.0% (Est. 48.1%) ๐ŸŸข

๐Ÿ”ธ FY25 CapEx: $38B - $42B (Est. $35.15B) ๐ŸŸข

๐Ÿ”น FY24 CapEx: $29.76B (Est. ~$29.5B)


Q1โ€™25 Guidance:

๐Ÿ”น Revenue: $25B - $25.8B (Est. $24.43B) ๐ŸŸข

๐Ÿ”น Gross Margin: 57% - 59%

๐Ÿ”น Operating Margin: 46.5% - 48.5% (Est. 46.4%) ๐ŸŸข

๐Ÿ”ธ Mngt expects a ~5.5% sequential revenue drop (smartphone seasonality) but sustained robust AI demand.


Long-Term Revenue CAGR: ~20% (2024โ€“2028)

๐Ÿ”ธ AI-related revenue was mid-teens percent of total in 2024 and is expected to double in 2025, with a ~40% CAGR for AI accelerators through 2029.

๐Ÿ”ธ AI & HPC cited as main growth engines

๐Ÿ”ธ Smartphone & PC segments also gain from higher silicon content


Q4 Process & Segment Details:

๐Ÿ”น Wafer Shipments: 3.418M; UP +15.6% YoY

๐Ÿ”น ASP per Wafer: ~$6,850 (FY basis); UP +19% YoY

๐Ÿ”น Advanced Technologies (7nm & below): 74% of total wafer revenue (vs. 69% in Q3)

๐Ÿ”น 3nm: 26% (vs. 20% in Q3)

๐Ÿ”น 5nm: 34% (vs. 32% in Q3)

๐Ÿ”น 7nm: 14% (vs. 17% in Q3)


Q4 Revenue by Product Platform

๐Ÿ”น HPC (incl. AI): 53% (vs. 51% in Q3) โ€” HPC up +69% YoY

๐Ÿ”น Smartphone: 35% (vs. 34% in Q3)

๐Ÿ”น IoT: 5%

๐Ÿ”น Automotive: 4%

๐Ÿ”น Consumer Electronics: 1%

๐Ÿ”น Others: 2%


Q4 Rev by Geography

๐Ÿ”น North America: 75% (vs. 71% in Q3)

๐Ÿ”น China: 9%

๐Ÿ”น Asia Pacific (ex-China): 9%

๐Ÿ”น Japan: 4%

๐Ÿ”น EMEA: 3%


Capital Expenditure:

๐Ÿ”ธ FY24 CapEx: $29.76B (Est. ~$29.5B)

ย โ€ข ~70% allocated to advanced nodes (N3, N2)

ย โ€ข ~10-20% for specialty tech & non-wafer (e.g., advanced packaging, mask)

๐Ÿ”ธ Sees FY25 CapEx: $38B - $42B (Est. $35.15B) ๐ŸŸข

ย โ€ข โ€œHigher than 2024โ€ to fund advanced nodes (N3, N2) & packaging expansions

ย โ€ข Overseas fabs contribute to increased spending

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