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TSMC Q4'24 Earnings Highlights

$TSM (+1,43 %)


🔹 Revenue: $26.24B (Est. 25.83B) 🟢; +39% YoY

🔹 Net Income: $11.31B (Est. $11.17B) 🟢; +57% YoY

🔹 Gross Margin: 59.0% (Est. 58.5%) 🟢; +53% YoY

🔹 Oper. Margin: 49.0% (Est. 48.1%) 🟢

🔸 FY25 CapEx: $38B - $42B (Est. $35.15B) 🟢

🔹 FY24 CapEx: $29.76B (Est. ~$29.5B)


Q1’25 Guidance:

🔹 Revenue: $25B - $25.8B (Est. $24.43B) 🟢

🔹 Gross Margin: 57% - 59%

🔹 Operating Margin: 46.5% - 48.5% (Est. 46.4%) 🟢

🔸 Mngt expects a ~5.5% sequential revenue drop (smartphone seasonality) but sustained robust AI demand.


Long-Term Revenue CAGR: ~20% (2024–2028)

🔸 AI-related revenue was mid-teens percent of total in 2024 and is expected to double in 2025, with a ~40% CAGR for AI accelerators through 2029.

🔸 AI & HPC cited as main growth engines

🔸 Smartphone & PC segments also gain from higher silicon content


Q4 Process & Segment Details:

🔹 Wafer Shipments: 3.418M; UP +15.6% YoY

🔹 ASP per Wafer: ~$6,850 (FY basis); UP +19% YoY

🔹 Advanced Technologies (7nm & below): 74% of total wafer revenue (vs. 69% in Q3)

🔹 3nm: 26% (vs. 20% in Q3)

🔹 5nm: 34% (vs. 32% in Q3)

🔹 7nm: 14% (vs. 17% in Q3)


Q4 Revenue by Product Platform

🔹 HPC (incl. AI): 53% (vs. 51% in Q3) — HPC up +69% YoY

🔹 Smartphone: 35% (vs. 34% in Q3)

🔹 IoT: 5%

🔹 Automotive: 4%

🔹 Consumer Electronics: 1%

🔹 Others: 2%


Q4 Rev by Geography

🔹 North America: 75% (vs. 71% in Q3)

🔹 China: 9%

🔹 Asia Pacific (ex-China): 9%

🔹 Japan: 4%

🔹 EMEA: 3%


Capital Expenditure:

🔸 FY24 CapEx: $29.76B (Est. ~$29.5B)

 • ~70% allocated to advanced nodes (N3, N2)

 • ~10-20% for specialty tech & non-wafer (e.g., advanced packaging, mask)

🔸 Sees FY25 CapEx: $38B - $42B (Est. $35.15B) 🟢

 • “Higher than 2024” to fund advanced nodes (N3, N2) & packaging expansions

 • Overseas fabs contribute to increased spending

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