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Siemens and TSMC jointly drive innovation in semiconductor design

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Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration

(WK-intern) - Siemens Digital Industries Software today announced that it has intensified its long-standing collaboration with TSMC to drive innovation in semiconductor design and integration and enable joint customers to address next-generation technology challenges.


https://www.windkraft-journal.de/2025/04/25/siemens-und-tsmc-treiben-gemeinsam-innovationen-im-halbleiterdesign-voran/211346

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